The 19th Electronic Ceramics and Ceramic Metal Sealing Conference

On September 17, 2019, the 10th Hunan International Expo, the 19th Electronic Ceramics and Ceramic Metal Sealing Conference, and the 2019 Vacuum Electronics and Special Metal Materials Branch Annual Conference were held in Loudi, Hunan. Hua Xuejian, Deputy Secretary of the Loudi Municipal Party Committee, delivered a speech, and Vice Mayor Zhao Yingliang, He Feng, and Vice Chairman of the Municipal Political Consultative Conference Li Deren attended. Loudi Economic and Technological Development Zone made investment promotion at the meeting. Liu Zheng, Director and Deputy General Manager of the 12th Research Institute of China Electronics Technology Group Corporation, Gao Qiao, Deputy General Manager of the 12th Research Institute of China Electronics Technology Group Corporation, Professor and Doctoral Supervisor Xie Zhipeng from Tsinghua University, Professor Zhou Kegang from Beijing University of Technology, Professor and Doctoral Supervisor Xiao Hanning from Hunan University, and other experts and scholars, as well as leaders of research institutions and colleges from all over the country, Enterprises and institutions, as well as over 300 people, attended the meeting.

The conference was undertaken by the Hunan Provincial People's Government, the Hunan Provincial Investment Promotion Bureau, the 12th Institute of China Electronics Technology Group Corporation, the Metal Materials Branch of the Vacuum Electronic Materials Industry Association, the Loudi Economic and Technological Development Zone, the Loudi Municipal Bureau of Commerce, and Loudi Yasi Electronic Ceramics Co., Ltd.

As the organizer, our company's chairman Kang Dinghua gave a speech on the theme of "Welding and Packaging of Advanced Ceramic Components in New Energy", detailing the application and market prospects of electronic ceramics in the field of new energy electric vehicles.

At the meeting, experts and scholars exchanged nearly 20 papers on the research and development of electronic ceramics, ceramic metal sealing, packaging and production processes, energy conservation and environmental protection, applications, and materials used, including "Preliminary Study on Thermal Strain Behavior of Active Metal Brazing (AMB) Ceramic Substrates" and "Discussion on Surface and Internal Micron Defects of Ceramic Parts", It involves many common key technical issues in the industry.

Through this meeting, we further learned about the latest trends in the research and industrial development of electronic ceramics and ceramic metallization sealing technology both domestically and internationally. At the same time, we enhanced our company's brand awareness in the industry and provided a good learning, communication, and interaction platform for participating units.